TSMC is reportedly building complex packaging capacity in Japan, which would boost Japan’s efforts to revive its semiconductor industry.
In a new report from Reuters, “two sources familiar with the matter” report that the Taiwanese giant is in its early stages, and that the resources “refuse to be known because the data is not public. “Still, TSMC is making plans to expand the generation of Wafer-on-Substrate (CoWoS) chip packaging in Japan.
All of TSMC’s new CoWoS capability is in Taiwan, so this would be a major step forward for Taiwan Semiconductor Manufacturing Company. TSMC recently built a new factory in Japan in just two hours, with staff working 24 hours a day, earning the site the nickname. “Castle without a night”. I’m sure there will still be plenty of sleepless nights if TSMC really builds a new generation of CoWoS packaging in Japan.
TSMC blatantly refused to comment on the news. However, we know that complex semiconductor packaging needs have increased at an unsustainable rate, which would require TSMC to build a new packaging plant in Japan. TSMC CEO C. C. Wei said in January 2024 that his company plans to double CoWoS production this year. with additional increases planned for 2025.
The company announced a more complex packaging capacity in Chiayi, southern Taiwan, to meet this demand, without offering further details. A new packaging plant in Japan would be interesting, but it shows that TSMC is moving away from doing these projects on U. S. soil. and prefers Japan (again).
Anthony joined the TweakTown team in 2010 and has since reviewed a bunch of graphics cards. Anthony is a lifelong PC enthusiast with an obnoxious penchant for games built around consoles. FPS gaming since the days before Quake, where you were insulted if you used a mouse for Target, has been addicted to gaming and hardware ever since. Working in IT retail for 10 years gave him a wealth of experience with traditional PCs. His addiction to the GPU generation is unwavering and he has recently voluntarily taken an interest in synthetic intelligence (AI). )hardware.
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